CVE-2016-2063

Description

Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.

Risk Information

Base Score

7.8

MODERATE

Vector

CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H

EPSS Score

Exploitation Probability

0.065

Associated Vulnerability

No records found

Patch Details

No records found

References

https://nvd.nist.gov/vuln/detail/CVE-2023-1234
https://cve.mitre.org/cgi-bin/cvename.cgi?name=CVE-2023-1234